Miniaturization demands and increasing functionality of modern integrated communication are facing numbers of challenges like
This leads to the necessity of new RF frontend concepts leveraging reconfigurable RF integrated circuits based on “digital-intensive” building blocks like sampling or sub-sampling receivers and RF-DAC or PWM based power amplifiers (Digital power amplifiers – DPA). Especially for future massive MIMO multi-antenna systems the co-existence problems and self-interference leakage will create significant performance limitations that needs to be improved by self-interference cancellation, typically implemented by digital base-band signal processing or preferably directly in the RF domain. Especially for MIMO systems, an efficient digital data communication to a “digital” transmitter and from a direct sampling receiver is nowadays a challenge which is researched in the RFFE-Lab. In addition, a strong functional diversification of semiconductor devices happened during past years moving from scaling driven system-on-chip (SoC) integration to heterogeneous integration concepts like system-in-package (SiP).
The traditionally separated fields of RFIC design, RFMW design, high-speed serial data links and heterogeneous integration of RF components should be merged in this research lab. An optimized modelling and chip-package-board co-design together with new partitioning of RF frontend topologies, chip-to-chip communication and RF self-interference cancelation are necessary requirements for realization of future multi-band, multi-frontend massive MIMO systems.
We will research and realize world-class, multi-band, multi-standard RF frontend solutions for future communication like 5G/6G massive MIMO communication systems with power efficient high-speed baseband digital data interfaces.
The massive growing complexity of future wireless communication RF frontends requires new multidisciplinary modelling, circuit design and integration concepts. This lab is researching
For all mentioned research topics the chip – package – board co-design in heterogeneous / hybrid integrated More-than-Moore systems is a fundamental know-how enabling area, power and performance optimized RF front-end solutions.